STRATOS S810-X52L (4-Node)

Ultra-dichter High-Computing-Multi-Knoten 2U Rackmount-Server

  • Extrem kompaktes Design mit hoher Rechenleistung und niedrigem Energieverbrauch
  • Gemeinsame Energieversorgung und Kühlung
  • Erweiterte I/O-Skalierbarkeit und Flexibilität
EOL

* Limited Availability * 
Please contact a local distributor or QCT local office for the product availability and support.

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  • 3rd Gen Intel Scalable processor

Ultra Dense High Computing Multi-node 2U Rackmount Server

Having 2x the computing density of traditional 2-way servers, the Quanta STRATOS S810-X52L is the densest multi-node 2U server in the market. It offers four individual 2-socket server nodes in a 2U rack chassis with node capable of populating up to 16 DIMM slots. The system features extremely high density, unsurpassed performance, and energy efficiency from shared power and cooling modules. The S810-X52L is Intel® Xeon® processor E5-2600/ E5-2600 v2 product family-based server platform, boosting its general performance by up to 80% over a previous generation Intel® Xeon® processor-based server, making it ideal for HPC, clustering, cloud infrastructure and datacenters demanding high computing and memory density.

Ultra-Dense Design with High Computing and Low Energy Draw

The STRATOS S810-X52L contains four independent hot-pluggable half-sized server nodes. Each node supports one or two 12-core Intel® Xeon® processor E5-2600/ E5-2600 v2 product family and 16 DDR3 DIMMs, which is the densest 2U server populating totally 64 DIMM slots in the market. Each S810-X52L node enables up to 2 times better technical computing performance with Intel® AVX and new Intel® Turbo Boost Technology, while getting up to 50% more performance per watt than previous generations. It also supports low-voltage DIMMs to lower datacenter operation costs with the least energy consumption and superb computing performance.

Shared Power and Cooling

The S810-X52L is designed to balance the usage of two hot-plug redundant power supplies, fans, backplanes to support four nodes. The unique design provides remarkable energy/cooling efficiency and infrastructure investment savings.

Enhanced I/O Scalability and Flexibility

The S810-X52L multi-node server provides extraordinarily flexible and scalable I/O configurations. It offers 2.5" and 3.5" 3Gb/6Gb HDDs or SSD options. Each node also provides the option of a USB flash module for OS installation. Its onboard network has choices between two GbE or 10GbE RJ45 ports. Customers can select the configuration that works best with their datacenter networking environment.

Expansion options include onboard Intel® SAS/RAID upgrade ROM, one standard PCIe x16 slot, and one PCIe x16 mezzanine slot for SAS/RAID or 10GbE SFP+ adaptor. By supporting PCIe 3.0, it improves I/O bandwidth up to 2 times from previous generation. I/O latency is also dramatically reduced with Intel® integrated I/O and Data Direct I/O technology, which helps datacenters eliminate data bottlenecks, streamline operations, and increase agility.

Zertifizierung
  • BSMI--Taiwan--EMISafety
  • CB-EU
  • CE-EU
  • Microsoft Windows 2012
  • Microsoft Windows  2012 R2
  • Microsoft Windows 2008
  • Microsoft Windows 2008 R2
  • FCC-ClassA-US
  • RHEL-5.10RHEL6.5RHEL7.0
  • RedHat-54
  • VCCI-classA-Japan この装置は、クラスA情報技術装置です。この装置を家庭環境で使用すると電波妨害を引き起こすことがあります。この場合には使用者が適切な対策を講ずるよう要求されることがあります
  • VMWare ESXi5.1-Update2ESXi 5.5-Update1
Prozessor
Processor Family
Intel® Xeon® processor E5 product family
Prozessortyp
Intel® Xeon® processor E5-2600 product family
Intel® Xeon® processor E5-2600 v2 product family
Max. TDP Unterstützung
130W or 135W*
* Restriction applies. Please contact Quanta Sales representive regarding 135W support
Anzahl Prozessoren
2 Processors
Interne Interconnect
6.4 / 7.2 / 8.0 GT/s
L3 Cache
Up to 30MB
Formfaktor
Formfaktor
2U
4 Nodes
Abmessungen
B x H x T (inch)
17.6 x 3.4 x 30.5
B x H x T (mm)
447 x 87 x 775
Chipsatz
Chipsatz
Intel® C602
Massenspeicher
Massenspeicher
2.5" Hot-plug
3.5" Hot-plug
Optionen
Option 1: (24) 2.5" hot plug
Option 2: (12) 3.5" hot plug
Arbeitsspeicher
Anzahl Slots
16
Kapazität
Up to 256GB RDIMM
UP to 512G LRDIMM
Speichertyp
1866/1600/1333 MHz DDR3 RDIMM
1600 MHz DDR3 LRDIMM
Speichergröße
16GB, 8GB RDIMM
32GB LRDIMM
Erweiterungssteckplatz
Erweiterungssteckplatz
(1) PCIe Gen3 x16, LP MD-2
(1) PCIe Gen3 x16 mezzanine slot
Netzwerkcontroller
LOM
Option 1:
Intel® I350 dual-port 1 GbE per node
Dedicated 10/100 management port per node
Option 2:
Intel® X540 dual-port 10GbE BASE-T per node
Dedicated 10/100 management port per node
Optionale NIC
Please refer to our Compatible Component List for more information
Festplatten-Controller
Onboard
(4) Intel® C602:
(4) SATA 3Gb/s ports
(2) SATA 6Gb/s ports
SATA RAID 0, 1, 5, 10
SAS RAID 0, 1, 5, 10 enabled with upgrade ROM options
Optionale Controller
Please refer to our Compatible Component List for more information
Netzteil
Netzteil
(2) high efficiency hot-plug 1400W PSU, 80 Plus Gold
or
(2) high efficiency hot-plug 1600W PSU, 80 Plus Platinum
integrierter Speicher
integrierten Speicher
Support UFM
Lüfter
Lüfter
(4) system fans
Video
Video
Integrated AST2300 with 8MB DDR3 video memory
System-Management
System-Management
IPMI v2.0 Compliant, on board "KVM over IP" support
Quanta Datacenter Manager 2.0/QDCM 2.0 (Optional)
hintere I/O
hintere I/O
(2) USB 2.0 ports
(1) VGA port
(1) RS232 serial Port
(2) 1 GbE or 10G BASE-T RJ45 port
(1) 10/100 RJ45 magement port
Betriebsumgebung
Betriebsumgebung
Operating temperature: 5°C to 35°C (41°F to 95°F)
Non-operating temperature: -40°C to 65°C (-40°F to 149°F)
Operating relative humidity: 50% to 85%RH.
Non-operating relative humidity: 20% to 90%RH
Gewicht (max. Konfiguration)
Gewicht (max. Konfiguration)
2.5": 27.3 (kg) / 60.19 (lbs)
3.5": 26.6 (kg) / 58.64 (lbs)

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Wir können Ihre Anfrage nicht abschließen !

Bitte besuchen Sie uns für weitere Informationen, oder lassen Sie uns wissen, wie wir Ihnen jetzt helfen können.