QuantaGrid D74A-7U
Accelerated Parallel Computing Performance for the Most Extreme AI-HPC Workloads
- Multiple-GPUs Server for HPC / AI Training ( e.g LLMs / NLP ).
- Powered by 2x 4th AMD EPYC9004 Processors and Compatible with Next-Gen AMD EPYC™ Processor in the future.
- Introducing NVIDIA HGX Architecture and Flexible with 8x NVIDIA H100/H200 GPUs or 8x AMD MI300X GPUs.
- 18x SFF All-NVMe Drive Bays for GPUDirect Storage and Boot Drive.
- 10x OCP NIC 3.0 TSFF for GPUDirect RDMA.
- Modularized Design for Easy Serviceability.
Multiple-GPUs Server for HPC / AI Training ( e.g LLMs / NLP )
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Modularized Design for Easy Serviceability
The architecture is designed around a toolless modular philosophy. Major components can be removed from the system chassis without unmounting from the rack for better serviceability and increased system uptime. The modularity in this innovative design allows for forward support of next generation CPUs and GPUs.
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Modularized Design for Easy Serviceability
The architecture is designed around a toolless modular philosophy. Major components can be removed from the system chassis without unmounting from the rack for better serviceability and increased system uptime. The modularity in this innovative design allows for forward support of next generation CPUs and GPUs.
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| プロセッサー | |
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| Processor Family |
AMD EPYC™
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| プロセッサータイプ |
AMD EPYC™ 9004 Series Server Processors
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| 最大 TDP サポート |
cTDP up to 400W
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| プロセッサー数 |
2 Processors
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| 内部インターコネクト |
16 GT/s
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| L3キャッシュ |
Up to 384 MB
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| フォームファクター | |
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| フォームファクター |
7U
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| 寸法 | |
|---|---|
| W x H x D (インチ) |
17.63" x 12.12" x 34.88"
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| W x H x D (mm) |
447.8 x 307.85 x 886mm
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| チップセット | |
|---|---|
| チップセット |
SoC
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| ストレージ | |
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| ストレージ |
(18) 2.5" hot-plug NVMe SSD drives
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| メモリー | |
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| 総スロット数 |
24
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| 容量 |
Up to 6TB (256Gx24) of memory capacity
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| メモリタイプ |
4800 MHz DDR5 RDIMM
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| メモリサイズ |
16G, 32G, 64G, 128G, 256G RDIMM/3DS DIMM
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| 拡張スロット | |
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| 拡張スロット |
(2) PCIe 5.0 x16 OCP 3.0 SFF slots (MB)
(10) PCIe 5.0 x16 OCP 3.0 TSFF slots (I/O Board) |
| Expansion Slot_GPGPU baseboard |
SKU - #1
(8) NVIDIA H100/H200 SXM GPU Modules with HGX Baseboard SKU - #2 (8) AMD MI300X GPU Modules with Industry-Standard-Based Universal Baseboard (UBB 2.0) |
| ネットワーク コントローラー | |
|---|---|
| LOM |
Dedicated (1) GbE management port
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| オプション NIC |
Please refer to our Compatible Component List for more information
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| 前面 I/O | |
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| 前面 I/O |
(1) Power button/LED
(1) Reset button (1) ID button/LED (1) System status LED (2) USB 3.0 (1) VGA port |
| 電源 | |
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| 電源 |
(6) 3+3 High Efficiency Redundant Hot-Plug 4000W 80 Plus Titanium PSUs
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| オンボード ストレージ | |
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| オンボードストレージ |
Onboard Storage (2) 2280 M.2 (Optional for Boot Drive)
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| ファン | |
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| ファン |
(8) hot-swap 9276 dual rotor fans (N+1 redundant)
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| ビデオ | |
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| ビデオ |
Integrated AST2600
Maximum display resolution is up to 1920x1080p 32bpp@60Hz |
| システム マネージメント | |
|---|---|
| システムマネージメント |
Redfish v1.11
IPMI v2.0 Compliant, on board "KVM over IP" support |
| 背面 I/O | |
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| 背面I/O |
(1) Power button
(1) ID button/LED (1) USB 3.0 port (1) Mini Display port (1) COM Port (micro USB type-B) (1) RJ45 dedicated mgmt port |
| 動作環境 | |
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| 動作環境 |
Operating temperature: 5°C to 35°C (41°F to 95°F)
Non-operating temperature: -40°C to 70°C (-40°F to 158°F) Operating relative humidity: 20% to 85%RH Non-operating relative humidity: 10% to 95%RH |
| TPM | |
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| TPM |
TPM 2.0 SPI module (optional)
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| 重量 (最大構成) | |
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| 重量 (最大構成) |
116.58 kg (257.01 lbs)
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