QuantaGrid D75F-7U

Seamless Data Processing and High-Performance AI at Scale

  • Powered by dual 5th/4th Gen Intel® Xeon® Scalable processors and 8x NVIDIA HGX™ H200 GPUs.
  • 18x SFF All-NVMe drive bays for GPU Direct Storage and boot drive
  • 2x NVIDIA® BlueField®-3 DPUs to minimize the bottleneck and empowering the performance for the most complex AI-HPC workloads
  • 8x HHHL SW PCIe Gen 5 x16 slots for 1:1 GPU-Direct RDMA
  • Modularized system design for optimal flexibility and easy serviceability
  • System optimized for generative AI, LLM, and HPC workloads
Upgrade with Higher Computing Performance

Introducing the QuantaGrid D75F-7U, an 8-way GPU server purpose-built for high-performance AI, large language models (LLMs), natural language processing (NLP), and critical business applications.

At its core, the D75F-7U features 5th/4th Gen Intel® Xeon® Scalable processors and 8x NVIDIA HGX™  H200 GPUs, delivering exceptional compute power. The 8-way NVIDIA HGX™ H200 GPU system provides over 32 petaflops of FP8 deep learning compute and 1.1 TB of aggregate high-bandwidth memory for generative AI and high-performance computing (HPC) applications. With NVIDIA NVLink®, it connects 8 H200 GPUs in a single node with 900GB/s interconnection, which is 7 times the bandwidth of PCIe Gen 5.

Seamless Data Processing and High-Performance AI at Scale

Upgrade with Higher Computing Performance

Upgrade with Higher Computing Performance

QuantaGrid D75F-7U support NVIDIA BlueField® -3 DPUs for North-South data transfer to eliminate bottlenecks in data processing; The system also support 18x 2.5'' NVMe storage drives for GPUDirect® Storage, and 1:1 GPUDirect® RDMA, to ensure high-speed cross-node communication for the most extreme AI workloads.

The D75F-7U stands as an ideal solution for AI inference, AI training, and data analytics, providing a robust and flexible architecture designed for resource-intensive workloads.

Maximizing Uptime: The Advantage of a Toolless Modular Architecture 

QuantaGrid D75F-7U features a unique modularized system design. Designed for efficiency, the architecture employs a toolless modular approach, enabling key components to be easily accessed and removed directly from the system chassis, even while it remains in the rack. This not only dramatically improves serviceability and system uptime but also guarantees seamless compatibility with future CPU and GPU advancements.

Upgrade with Higher Computing Performance

Processor
Processor Type
5th/4th Gen Intel® Xeon® Scalable Processors
Max. TDP Support
350W
Number of Processors
2 Processors
Internal Interconnect
Up to 20 GT/s
Form Factor
Form Factor
7U
Dimensions
W x H x D (inch)
17.63” x 12.12” x 37.4”
W x H x D (mm)
447.8 x 307.85 x 950mm
Chipset
Chipset
Intel® C741
Storage
Default Configuration
(18) 2.5" hot-plug NVMe SSD drives
Memory
Total Slots
32
Capacity
Up to 8TB
Memory Type
5600 MT/s DDR5 RDIMM / 3DS RDIMM
Expansion Slot
Default Configuration
(2) FHHL DW PCIe Gen5 x16 slots
(8) HHHL SW PCIe Gen5 x16 slots
Expansion Slot_GPGPU baseboard
8x Hopper H200 SXM5 GPU modules with HGX baseboard
Network Controller
LOM
Dedicated (1) GbE management port
Optional NIC
Please refer to our Compatible Component List for more information
Front I/O
Front I/O
(1) Power button/LED
(1) Reset button
(1) ID button/LED
(1) System status LED
(2) USB 3.0
(1) VGA port
Power Supply
Power Supply
Option1: 4+2 high efficiency redundant hot-plug 4000W 80 Plus Titanium PSUs
Onboard Storage
Onboard Storage
(2) 2280 M.2
Fan
Fan
(8) hot-swap 9276 dual rotor fans (15+1 rotor redundant)
Video
Video
Integrated AST2600
Maximum display resolution is up to 1920x1080p 32bpp@60Hz
System Management
System Management
Redfish v1.15
IPMI v2.0 compliant, on board “KVM over IP” support
Rear I/O
Rear I/O
(1) Power button
(1) ID button/LED
(1) USB 3.0 port
(1) Mini Display port
(1) COM Port (micro USB type-B)
(1) RJ45 dedicated mgmt port
Operating Environment
Operating Environment
Operating temperature: 5°C to 35°C (41°F to 95°F)
Non-operating temperature: -40°C to 70°C (-40°F to 158°F)
Operating relative humidity: 20% to 85%RH
Non-operating relative humidity: 10% to 95%RH
TPM
TPM
TPM 2.0 SPI module (optional)
Weight (Max. Configuration)
Weight (Max. Configuration)
123kg (271.17 lbs)

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